Cx31993 Datasheet Fix Hot !!top!! Page

The "fix" for the CX31993 "hot" issue requires a revision of the datasheet to provide realistic thermal parameters. The previous specification of 32°C/W creates a false sense of thermal margin.

Excessive heat is often linked to "stuttering" or "crackling" caused by high processing loads. Increase Buffer Size : If using USB Audio Player Pro (UAPP) , go to settings and increase the USB audio buffer size . This reduces the real-time processing stress on the chip. Disable Bit-Perfect Mode cx31993 datasheet fix hot

The datasheet explicitly states: "An external LDO with ripple < 50mV is recommended." Yet many budget dongles connect VBUS (5V nominal, often 5.25V) directly to the chip via a simple resistor divider or no regulator at all. forces internal ESD clamps and regulators into saturation, dissipating excess voltage as heat. The "fix" for the CX31993 "hot" issue requires

Do this if you see HF ripple or the chip heats up even with no audio. Increase Buffer Size : If using USB Audio

The datasheet suggests a properly designed PCB should dissipate heat efficiently. Yet, the "hot" issue suggests many OEM dongles are operating at 100°C+ , far exceeding specs.

The CX31993 USB-C DAC is a high-performance, budget-friendly chip often paired with a MAX97220 amp to drive IEMs. Users frequently report the DAC overheating and producing static or noise, particularly on PCs, with troubleshooting tips including adjusting Windows audio settings to 24-bit/48kHz or increasing buffer sizes in apps like UAPP. More details on this DAC can be found at audioreviews.org audioreviews.org Conexant (CX-Pro) CX31993 USB-C Amp/DAC Review

Not every hot CX31993 is broken. The datasheet allows for junction temperatures up to 125°C. If your device meets the following, the heat is normal: